Introduction APECS pilot line by Fraunhofer/FMD

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Date and time

Tuesday
23
September
10:00 CEST
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What is APECS?

APECS (Advanced Packaging and Integration for Electronic Components and Systems) intends to establish itself as the pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems based on chiplets, QMI, RF, opto, sensor as well as passive components. The APECS pilot line will enable access to critical services, skills and training for European companies, especially SMEs, to integrate and package chiplets into novel electronic components and systems. Hence, it will open up a whole new landscape of new markets and opportunities for European business models. All developments will be carried out in accordance with the requirements of the European green deal.
Presentation by
  • Ben van der Zon, Consultant Semicon and International Business, Project Manager, High Tech NL
  • Felix Mohn, Manager Business Development | APECS Pilot Line, Research Fab Microelectronics Germany (FMD) 
  • Erik Jung, Senior Business Developer, Fraunhofer IZM
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Duration
60 minutes

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