Je kunt je niet meer inschrijven voor dit webinar
You can view this webinar from your computer, tablet or mobile phone.

What is APECS?

APECS (Advanced Packaging and Integration for Electronic Components and Systems) intends to establish itself as the pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems based on chiplets, QMI, RF, opto, sensor as well as passive components. The APECS pilot line will enable access to critical services, skills and training for European companies, especially SMEs, to integrate and package chiplets into novel electronic components and systems. Hence, it will open up a whole new landscape of new markets and opportunities for European business models. All developments will be carried out in accordance with the requirements of the European green deal.
Presentation by
  • Tom van der Dussen, international relations manager semiconductors, High Tech NL
  • Felix Mohn, Manager Business Development, Fraunhofer/FMD
  • Dr. Michael Töpper, Senior Expert Technologies and Business Development, Fraunhofer/FMD 
  •  Dr.-Ing. Christoph Kroh, Manager Business Development, Fraunhofer/FMD
​​​​​​​Duration
60 minutes

Share this webinar